Kubuchwepheshe besimanje bokuboniswa kwe-elekthronikhi, isibonisi se-LED sisetshenziswa kakhulu kuzimpawu zedijithali, ingemuva lesiteji, umhlobiso wasendlini nezinye izinkambu ngenxa yokukhanya kwawo okuphezulu, ukucaca okuphezulu, impilo ende nezinye izinzuzo. Enqubweni yokukhiqiza yesibonisi se-LED, ubuchwepheshe be-encapsulation buyisixhumanisi esiyinhloko. Phakathi kwazo, ubuchwepheshe be-SMD encapsulation kanye nobuchwepheshe be-COB encapsulation yi-encapsulation emibili evamile. Ngakho, uyini umehluko phakathi kwabo? Lesi sihloko sizokunikeza ukuhlaziywa okujulile.
1.iyini ubuchwepheshe bokupakisha be-SMD, isimiso sokupakisha se-SMD
Iphakethe le-SMD, igama eligcwele le-Surface Mounted Device (Idivayisi Ekhwezwa Ngaphezulu), iwuhlobo lwezingxenye ze-elekthronikhi ezishiselwe ngokuqondile ebhodini lesekethe eliphrintiwe (PCB) lobuchwepheshe bokupakisha obungaphezulu. Lobu buchwepheshe ngomshini wokubeka ngokunemba, i-chip ye-LED ehlanganisiwe (imvamisa iqukethe ama-diode akhipha ukukhanya kwe-LED kanye nezingxenye zesekethe ezidingekayo) ibekwe ngokunembile kumaphedi e-PCB, bese ngokusebenzisa i-reflow soldering nezinye izindlela zokubona uxhumano lukagesi.Ukupakishwa kwe-SMD ubuchwepheshe benza izingxenye ze-elekthronikhi zibe zincane, zibe lula ngesisindo, futhi zihambisane nomklamo wemikhiqizo ye-elekthronikhi ehlangene futhi engasindi.
2.Izinzuzo Nebubi Be-SMD Packaging Technology
2.1 Izinzuzo ze-SMD Packaging Technology
(1)usayizi omncane, isisindo esincane:Izingxenye zokupakisha ze-SMD zincane ngosayizi, kulula ukuhlanganisa ukuminyana okuphezulu, okuhambisana nokuklanywa kwemikhiqizo ye-elekthronikhi encane futhi engasindi.
(2)izici ezinhle zefrikhwensi ephezulu:izikhonkwane ezimfushane nezindlela ezimfushane zokuxhuma zisiza ukunciphisa i-inductance nokumelana, ukuthuthukisa ukusebenza kwe-high-frequency.
(3)Ilungele ukukhiqiza okuzenzakalelayo:ilungele ukukhiqizwa komshini wokubeka ngokuzenzakalelayo, ukuthuthukisa ukusebenza kahle kokukhiqiza nokuzinza kwekhwalithi.
(4)Ukusebenza kahle kwe-thermal:ukuthintana okuqondile nendawo ye-PCB, okuvumela ukuqeda ukushisa.
2.2 SMD Packaging Technology Ububi
(1)ukunakekelwa okuyinkimbinkimbi: nakuba indlela yokufaka ingaphezulu yenza kube lula ukulungisa nokushintsha izingxenye, kodwa esimweni sokuhlanganiswa okuphezulu, ukushintshwa kwezingxenye ngazinye kungase kube nzima kakhulu.
(2)Indawo ekhawulelwe yokukhipha ukushisa:ikakhulukazi ngokusebenzisa i-pad kanye nokushisa kwejeli, umsebenzi wesikhathi eside womthwalo ophezulu ungase uholele ekugxilweni kokushisa, okuthinta impilo yesevisi.
3.iyini ubuchwepheshe bokupakisha be-COB, isimiso sokupakisha se-COB
Iphakethe le-COB, elaziwa ngokuthi yi-Chip on Board (iphakheji ye-Chip on Board), iyi-chip engenalutho eshiselwe ngokuqondile kubuchwepheshe bokupakisha be-PCB. Inqubo ethile i-chip engenalutho (umzimba we-chip kanye namatheminali e-I/O kukristalu ngenhla) ene-adhesive conductive noma eshisayo ehlanganiswe ne-PCB, bese idlula ocingweni (olufana ne-aluminium noma igolide) ku-ultrasonic, ngaphansi kwesenzo. yokucindezela kokushisa, amatheminali e-I/O e-chip kanye namaphedi e-PCB axhunywe phezulu, futhi ekugcineni avalwa ngokuvikela okunamathelayo kwe-resin. Le encapsulation iqeda izinyathelo zendabuko ze-LED ze-bead encapsulation, okwenza iphakheji lihlangane kakhulu.
4.Izinzuzo kanye nokubi kobuchwepheshe bokupakisha be-COB
4.1 Izinzuzo zobuchwepheshe bokupakisha be-COB
(1) iphakethe elihlangene, usayizi omncane:ukususa izikhonkwane ezingezansi, ukufeza usayizi wephakheji omncane.
(2) ukusebenza okuphezulu:intambo yegolide exhuma i-chip nebhodi lesifunda, ibanga lokudlulisa isignali lifushane, linciphisa i-crosstalk kanye ne-inductance nezinye izinkinga zokuthuthukisa ukusebenza.
(3) Ukukhipha ukushisa okuhle:i-chip ishiselwe ngokuqondile ku-PCB, futhi ukushisa kukhishwa kulo lonke ibhodi le-PCB, futhi ukushisa kushabalaliswa kalula.
(4) Ukusebenza okuqinile kokuvikela:idizayini ebiyelwe ngokugcwele, enokuvikela amanzi, umswakama-umswakama, ukuvikela uthuli, i-anti-static kanye neminye imisebenzi yokuvikela.
(5) umuzwa omuhle wokubonwayo:njengomthombo wokukhanya ongaphezulu, ukusebenza kombala kucace kakhudlwana, ukucubungula imininingwane okuhle kakhulu, kulungele ukubuka isikhathi eside eduze.
4.2 Ububi bobuchwepheshe bokupakisha be-COB
(1) ubunzima bokulungisa:i-chip ne-PCB yokushisela ngokuqondile, ayikwazi ukuhlakazwa ngokuhlukana noma esikhundleni se-chip, izindleko zokulungisa ziphezulu.
(2) izidingo eziqinile zokukhiqiza:inqubo yokupakisha yezidingo zemvelo iphezulu kakhulu, ayivumeli uthuli, ugesi omile kanye nezinye izici zokungcola.
5. Umehluko phakathi kobuchwepheshe bokupakisha be-SMD kanye nobuchwepheshe bokupakisha be-COB
Ubuchwepheshe be-SMD encapsulation kanye nobuchwepheshe be-COB encapsulation emkhakheni wokuboniswa kwe-LED ngayinye inezici zayo eziyingqayizivele, umehluko phakathi kwabo ubonakala ngokuyinhloko ekuhlanganiseni, ubukhulu nesisindo, ukusebenza kokushisa kokushisa, ukukhululeka kokugcinwa kanye nezimo zohlelo lokusebenza. Okulandelayo ukuqhathanisa okuningiliziwe nokuhlaziya:
5.1 Indlela yokupakisha
⑴Ubuchwepheshe bokupakisha be-SMD: igama eligcwele i-Surface Mounted Device, okuwubuchwepheshe bokupakisha obuthengisa chip ye-LED ehlanganisiwe ebusweni bebhodi lesekethe eliphrintiwe (PCB) ngomshini wokunemba wokuchibiyela. Le ndlela idinga ukuthi i-chip ye-LED ihlanganiswe kusenesikhathi ukuze yakhe ingxenye ezimele bese ifakwa ku-PCB.
Ubuchwepheshe bokupakisha be-⑵COB: igama eligcwele i-Chip on Board, okuwubuchwepheshe bokupakisha obuthengisa ngokuqondile i-chip engenalutho ku-PCB. Iqeda izinyathelo zokupakishwa zobuhlalu belambu le-LED lendabuko, ibopha ngokuqondile i-chip engenalutho ku-PCB ngeglue conductive noma eshisayo, futhi ibona uxhumano lukagesi ngentambo yensimbi.
5.2 Ubukhulu nesisindo
⑴Ukupakishwa kwe-SMD: Nakuba izingxenye zincane ngosayizi, usayizi wazo nesisindo zisanqunyelwe ngenxa yesakhiwo sokupakisha kanye nezidingo zephedi.
⑵Iphakheji ye-COB: Ngenxa yokukhishwa kwezikhonkwane ezingezansi negobolondo lephakheji, iphakheji ye-COB ifinyelela ukubumbana okwedlulele, okwenza iphakheji libe lincane futhi libe lula.
5.3 Ukusebenza kokukhipha ukushisa
⑴Ukupakishwa kwe-SMD: Ikakhulukazi ikhipha ukushisa ngamaphedi nama-colloid, futhi indawo yokukhipha ukushisa ilinganiselwe. Ngaphansi kokukhanya okuphezulu nezimo zokulayisha okuphezulu, ukushisa kungase kugxiliswe endaweni ye-chip, kuthinte impilo nokuzinza kwesibonisi.
⑵Iphakheji ye-COB: I-chip ishiselwe ngokuqondile ku-PCB futhi ukushisa kungahlakazwa kulo lonke ibhodi le-PCB. Lo mklamo uthuthukisa kakhulu ukusebenza kokukhipha ukushisa kwesibonisi futhi wehlise izinga lokuhluleka ngenxa yokushisa ngokweqile.
5.4 Ukunakekela kahle
⑴Ukupakishwa kwe-SMD: Njengoba izingxenye zifakwe ngokuzimela ku-PCB, kulula ngokuqhathaniswa ukushintsha ingxenye eyodwa ngesikhathi sokulungiswa. Lokhu kusiza ekwehliseni izindleko zokunakekela kanye nokunciphisa isikhathi sokunakekela.
Ukupakishwa kwe-⑵COB: Njengoba i-chip ne-PCB kushiselwe ngokuqondile kuphelele, akunakwenzeka ukuqaqa noma ukufaka esikhundleni se-chip ngokuhlukana. Uma iphutha lenzekile, ngokuvamile kuyadingeka ukuthi kushintshwe lonke ibhodi le-PCB noma kulibuyisele efekthri ukuze lilungiswe, okwandisa izindleko nobunzima bokulungisa.
5.5 Izimo zohlelo lokusebenza
⑴Ukupakishwa kwe-SMD: Ngenxa yokuvuthwa kwayo okuphezulu kanye nezindleko eziphansi zokukhiqiza, isetshenziswa kakhulu emakethe, ikakhulukazi kumaphrojekthi angabizi kakhulu futhi adinga ukunethezeka kokulungisa okuphezulu, njengamabhodi okukhangisa angaphandle nezindonga ze-TV zasendlini.
⑵I-COB yokupakishwa: Ngenxa yokusebenza kwayo okuphezulu nokuvikela okuphezulu, ifaneleka kakhulu kuzikrini zokubonisa zasendlini ezisezingeni eliphezulu, izibonisi zomphakathi, amagumbi okuqapha nezinye izigcawu ezinezidingo zekhwalithi ephezulu nezimo eziyinkimbinkimbi. Isibonelo, ezikhungweni zokuyala, ama-studio, izikhungo ezinkulu zokuthunyelwa kwezimpahla nezinye izindawo lapho abasebenzi bebuka isikrini isikhathi eside, ubuchwepheshe bokupakisha be-COB bunganikeza ulwazi olubonakalayo oluthambile futhi olufana nolunye.
Isiphetho
Ubuchwepheshe bokupakisha be-SMD kanye nobuchwepheshe bokupakisha be-COB ngayinye inezinzuzo zayo ezihlukile kanye nezimo zohlelo lokusebenza emkhakheni wezikrini zokubonisa ze-LED. Abasebenzisi kufanele balinganise futhi bakhethe ngokwezidingo zangempela lapho bekhetha.
Ubuchwepheshe bokupakisha be-SMD kanye nobuchwepheshe bokupakisha be-COB bunezinzuzo zabo siqu. Ubuchwepheshe bokupakisha be-SMD busetshenziswa kabanzi emakethe ngenxa yokuvuthwa kwabo okuphezulu kanye nezindleko eziphansi zokukhiqiza, ikakhulukazi kumaphrojekthi angabizi kakhulu futhi adinga ukulungiswa okuphezulu. Ngakolunye uhlangothi, ubuchwepheshe bokupakisha be-COB, bunokuncintisana okuqinile ezikrinini zokubonisa zasendlini ezisezingeni eliphezulu, izibonisi zomphakathi, amagumbi okuqapha nezinye izinkambu ngokupakishwa kwawo okuhlangene, ukusebenza okuphakeme, ukushabalaliswa kokushisa okuhle nokusebenza okuqinile kokuvikela.
Isikhathi sokuthumela: Sep-20-2024
